Electronics manufacturers who try to save money by repairing and repairing electronic products and printed circuit boards appreciate the benefits of the IPC-7711/7721 Standard for the Rework, Repair and Modification of Electronic Products. This widely used standard offers a number of industry-approved methods for assembly of THD and SMD components, repairing sites, pads, and boards.

The training and certification programme is designed to obtain the IPC - 7711/7721 Specialist (CIS) certificate. The training program consists of 9 modules, the first of which is compulsory, the others can be chosen as needed.


Duration of (initial) certification training: 4 working days.
Duration of recertification training: 2 working days.
Training is paid.

Course modules


  • IPC Policies and Procedures / General Procedures [Mandatory]
  • Wire preparation and soldering
  • Removal and restoration of coating
  • Soldering and desoldering of through-hole components
  • Soldering and desoldering of SMT Chip and MELF components
  • Soldering and desoldering of Gull Wing - SOT, SOIC, QFP components
  • Soldering and desoldering of J-Lead - PLCC components
  • * BGA components [theoretical, upon request]
  • PCB laminate repairs
  • PCB track repairs 

During the sessions, participants are taught to find, recognise and repair defects in electronic products. The theoretical part introduces the organisation of IPC, the application and purpose of standards, appropriate behavior in the workplace, care, handling of products, typical soldering operations, sequences and methods, equipment, tools and materials. Typical electronic components are reviewed. Identification and evaluation of possible soldering defects and their causes (according to the IPC-A-610 standard) is also taught.

Soldering tasks performed during the practical sessions include: preparation of the board and components for soldering, soldering of surface-mount (SMD) and through hole (THD) components in training boards. Insulation stripping, bleaching, repair of broken tracks, pads and metallized holes. Plate cleaning, ESD requirements. Microscopic inspection of soldering quality, correction of defects. 

More detailed information is available on

All materials, tools and literature are provided during the training. If necessary, the training programme is adapted to the needs of the company, emphasising or supplementing relevant methods and requirements. The date can be adjusted according to the needs of the company. If necessary, training can be conducted at the company's premises.